SMT
PCB laser printing 
stencil printing
SMD glueing
SMD placement
reflow soldering
AOI (autom. opt. inspection)
AXI (autom. xray inspection)

Rommel WL2010 LC
MPM AP25
MPM AP EXCEL
DEK 265 GSX
DEK Horizon 01i
Siplace 80G2
Siplace 80 S/F
Siplace HS60
Siplace HF
Rehm V6 N2
Rehm V8 N2
OptiCon Advanced Line (Goepel)
Agilent HP5DX Series 3 

PCB size:
80x80 mm - 460x508 mm; 0.5 - 4.5 mm thick
smaller PCBs as multiple PCB
component spectrum: 0201- 55x55 mm
fine pitch 0.4; BGA, CSP

       
job size: 1 - 10 000 PCBs
process: plumbiferous or lead free (JEDEC 20C)
Reflow: with or without nitrogen
SMT placement capacity: 600 m/year
AXI and AOI: programming and debugging

THT
component preparation,
THT insertion,
wave soldering,
selective soldering,
special placement,
pre- and end assembly

Streckfuss
Royonic 500
ERSA Powerflow
ERSA EWS330 N2
ERSA NWAVE
ERSA Versaflow 5060 N2
INERTEC ELS 4.0
Celtronix - special placement

component spectrum:
all usal component models, axial and radial
PCB size (wave soldering):
up to 450x270 mm
with special tool frame
PCB size (selective soldering):
max. 500x600 mm;
80x120 mm with universal tool frame
assembly: connectors, assembly utilities,
front boards, heat sinks etc.

components preparation:
preparation for manual insertion
manual insertion: light marker controlled
wave soldering:  with tool frames or mask frames
(with or without nitrogen)
selective soldering: with or without tool frames,
lead free with second crucible (with nitrogen) 

PCB cutting and milling

GAS SAR-130-B

milling range: 430x 350mm

accuracy: 0.02mm

backplane
SMT process,
reflow soldering
press-fit connectors
THT insertion
hand/selective soldering

SIPLACE F4
Rehm V8 N2
WM 610
ERNI - press EPC 24
ERSA Versaflow 5060 N2

PCB - dimensions (SMT / press fit):
max. 460x508 mm; up to 7 mm thick
press fit: product related tools
PCB dimensions (THT/selective):
max. 500x600 mm; max. 3.5 mm thick

       
press fit:
PCB from 3.5 mm thick: chem. sn -  surface

electrical test
ICT / HP test systems
APT Flying Probe
Boundary Scan
dyn. function test
system test



















Bluetooth Testsystem

       
HP3070
HP3179
APT9400CE
PGA ( autom. interface
related test systems)
AMS_01/02 (autom. interface
applied test systems)
INTEPRO 6500
SPEA / UNITEST 50 FR















R&S CBT

       
ICT: 2/4 modules, up to 2160 test pins
product related nails adapter
APT PCB dimension:
50x50 mm - 400x500 mm
APT max. component assembly hight:
50 mm top, 35 mm bottom
dyn. testing:
product related adapter

       
ICT: Boundary Scan
HP Testjet, Transmissions Tests
HP Connect Check, POTS function test,
APT: CAD data editing with  FAB master,
Mentor, other data format after arrangement

dynamic function test:

universal test system for line termination
devices, ISDN devices, optical devices
for FMX, FastLink, MSAP, AMGW, CPE

universal test system for signal converters,
data cards, CPU and broadband cards for
FMX, FastLink, MSAP, AMGW, CPE (NTBA)

universal test system for power supply units
for FMX, FastLink, MSAP, SDH, etc.
test sequence generation with Powerstar TM

universal test system for the ICT and
function test of power supply, power
distribution, fan controller, etc.

Bluetooth Core Specification V1.1/2.0+EDR / 
RF Test Specification V1.2/V2.0/V2.0+EDR

manual soldering repair process
SMD / THT - final soldering
changing components
component and/or circuit extensions 

       
Fineplacer Jumbo
Weller
JBC
Ersa

all usual components models incl. BGA

       
BGA changing with nitrogen and
3D AXI inspection

cable preparation
cable cutting
crimp connection
screw connection
clamp connection
testing

       
Ramatech /Speedy (cable length
cutting automat)
various cutting and crimping machines
safety press machine
cable test equipment

       
cutting lenght: 0.25 m - 1000 m
diameter: up to 35 mm
length tolerance +/- 0.5 %
cable types:
hookup wire, braid wire, round cable,
coaxial cable, flat cable
test parameters:
cable resistance, shorts, isolation,
reflection, attenuation

unit assembly
units and unit shelves
modules
testing of backplanes
testing of units

       
Avdel - rivet station
circuit test equipment
special test equipment

       
test resistance, shorts and opens
component testing (R,C,L,diode)
testing other electrical features
data transmission by I²C

       
assembly units and shelves
by screw and rivet connection

system assembly
system pre-integration,
system test

       
Metratester
safety system PI 3301 K

       
safety test
EN60950, DIN VDE 0701, BGV A2
configuration of electrical and
electronical products
test of function
burn-in tests
creating test reports and storing test data
configuration of products to customer specification

calibration
(B-calibration laboratory including
Siemens calibriation service)

       
multi-functional calibrator DATRON

       
calibration of:
DC/AC
I-DC/I-AC
resistance
level
attenuation
reflection
frequency

       
computer aided calibration
digital multimeter, power supply
test automation with IEC Interface